Helion signs intent for up to $175M CHIPS R&D funding

Helion has signed a letter of intent with the U.S. Department of Commerce to receive up to $175 million in funding through the CHIPS Research and Development Office. The award, accompanied by $50 million in private investment, will support U.S.-based research, advanced-packaging capabilities, and manufacturing of high-voltage semiconductors for commercial fusion energy. The initiative aims to remove global supply-chain constraints and establish domestic production in Washington and Vermont. Open article →