GlobalFoundries VP details FDX Fusion technology, sporting 7nm-class performance without the need for EUV tools — company targets 2030 for high-volume manufacturing, with planar transistors in tow

GlobalFoundries vice president Sudipto Bose detailed the company's upcoming FDX Fusion technology, an FD-SOI process designed to deliver 7nm-class performance and 8nm-class logic density using advanced planar transistors without requiring EUV lithography tools. The company is targeting initial customer production for 2028 and high-volume manufacturing by 2030, aiming to provide a cost-competitive option for edge AI, automotive radar, and data center connectivity. Open article →