China's AI Chip Stack: Design Progress and Memory Vulnerabilities

A report evaluating China's AI chip stack indicates that chip design and system assembly are the furthest along, while memory and advanced wafers remain the weakest areas. Evidence from a recent teardown showed that Huawei's Ascend 910C accelerator samples contained memory from Samsung and SK Hynix, despite Huawei having announced its own high-bandwidth memory designs. Open article →