OCP Summit vendors propose 3.2TB LPDDR5X XPU memory expansion

At the 2026 OCP Global Summit, several vendors presented new approaches to overcoming the AI memory wall by expanding the memory hierarchy beyond HBM. SK hynix proposed moving memory into a dedicated rack and stacking NAND beside the GPU, while Metrum AI and Solidigm examined shared SSD pools, and Nallasway designed an XPU module connecting 3.2TB of LPDDR5X through SerDes. Open article →