Infineon marks innovation milestone with world’s first | Infineon Technologies

Infineon Technologies announced it has successfully processed the world’s first 300-millimeter silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria. The company utilized existing silicon manufacturing equipment to achieve the milestone, which yields 2.3 times more chips per wafer than 200-millimeter wafers. Infineon plans to showcase the processed wafer at the electronica trade show in Munich. Open article →