TSMC partners with Kinsus on EMIB-like packaging

TSMC is reportedly developing an EMIB-like packaging technology with Taiwan-based chip substrate maker Kinsus to find alternatives amid tight CoWoS capacity constraints for AI chips. The reported design places small silicon bridges directly in the package substrate instead of using a full silicon interposer, which can improve cost, yield, and scalability. Meanwhile, Nvidia and Google have reportedly shown interest in Intel's EMIB approach, with Nvidia evaluating the technology and Google planning significant TPU production with Intel. Open article →